RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin
$21.99
RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

availability:In stock

Shipping: Free Airmail
Dispatch: Ships within 2-5 business days
Estimated Delivery: Between

$21.99

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Product Description

Features:

1.Meet the maintenance needs of motherboards for Huawei and Applee high-end machines
2.A low temperature lead-free solder paste customized for high-end motherboard repair
3. RL-404 138 ° C low temperature solder paste

Specification:

Model Number: RL-404
Melting Point: 138 ° C
Weight: 40g

Package included:

1 x Tin Paste 

Details Pictures:

More Detailed Photos:

RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin
RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repair Tin

Additional Information

When you order from Alexnld.com, you will receive a confirmation email. Once your order is shipped, you will be emailed the tracking information for your order’s shipment. You can choose your preferred shipping method on the Order Information page during the checkout process. Alexnld.com offers 3 different international shipping methods, Airmail, Airmail registered and Expedited Shipping Service, following are delivery times:

Airmail and Airmail Registered Area Time
United States, Canada 10-25 business days
Australia, New Zealand, Singapore 10-25 business days
United Kingdom, France, Spain, Germany, Netherlands, Japan, Belgium, Denmark, Finland, Ireland, Norway, Portugal, Sweden, Switzerland 10-25 business days
Italy, Brazil, Russia 10-45 business days
Other countries 10-35 business days
Expedited Shipping 7-15 business days to Worldwide

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